Daim npav Technical SpecificationsChip Hom: MIFARE Ultralight AESCommunication Protocol: IEC / ISO 14443 AOoperating zaus: 13.56MHz Storage Capacity: 144 bytesRead/Write nrug: Txog li 10cmErase/Sau Cycles: Loj dua 100,000 Sijhawm Nyeem/Sau Sijhawm: 1-2msOperating kub: -20℃ ~ + 55 ℃ Cov ntaub ntawv khaws sijhawm: 5 xyooEncapsulation Material: PVC / Polycarbonate / ABS / PET / PETG / Ntawv, 0.13 Copper WireSize: 85.5× 54 × 0.80 ± 0.4mmCoil: Ultrasonic Tsis Siv Neeg WindingWelding txheej txheem: Automatic Spot Welding Ceeb Toom: JavaScript yuav tsum muaj rau cov ntsiab lus no.