主な技術パラメータ通信プロトコル: ISO 14443 タイプA / B, ISO 15693, EPC GEN2クラス 1/ ISO 18000-6CCan package low-frequency chips (125キロヘルツ): TK4100, EM4200, T5577, HITAG 2, HITAG S, etc.Can package high-frequency chips (13.56メガヘルツ): FM11RF08, M1 S50 / S70, ULT, I-CODE2, NTAG215, TI2048, SRI512, etc.Can be packaged UHF chips (860MHzの〜の960MHz): UCODE GEN2, ALIEN H3, ImpinjのM4, etc.Material: Soft SiliconeWorking years: > 10 yearsMaximum reading range: …