Main technical parametersCommunication protocol: ISO 14443 TypeA / B, ISO 15693, EPC GEN2 Klass 1/ ISO 18000-6CCan package low-frequency chips (125KHz): TK4100, EM4200, T5577, Hitag 2, Hitag S, etc.Can package high-frequency chips (13.56zréckkomm): FM11RF08, M1 S50 / S70, ULT, Ech-CODE2, NTAG215, TI2048, SRI512, etc.Can be packaged UHF chips (860Zréckkomm ~ 960MHz): UCODE GEN2, friem H3, Impinj M4, etc.Material: Soft SiliconeWorking years: > 10 Joer Maximal Liesbereich: …