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Kadhi Around / Zvishongedzo

» Kadhi Around / Zvishongedzo

RFID Chip COB Bonding, RFID Wafer Bonding, RFID COB Processing

CHIKAMU NEMATEG:
Kadhi Around / Zvishongedzo , , , , , , ,

Product model: YY0009

Can be bonding HF/LF wafers, made into bulk (grain) or COB. Can be processed by incoming materials, and wafer/COB can also be provided.

kubvunza
  • Magadzirirwo
  • Tsananguro

RFID Wafer: EM4102, TK4100, MFIC S50/S70, FM11RF08, ATA5577, EM4305, nezvimwewo.
Kakawanda: 125KHz/13.56MHz

RFID COB processing services: wafer bonding, COB soft plate making, COB making (the frequency is 125KHz and 13.56MHz)
Processing equipment: Automatic Die Bonder, Automatic Wire Bonder, Draught Drying Cabinet,nezvimwewo.
Quantity of processing equipment: 12
Daily processing capacity: 280,000 pcs/day
The lowest market price, the fastest delivery

Zvimwe unodawo

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