Boemo ba Sehlahiswa Lebitso la Sehlahiswa：Ucos 3.0 Li-chip tsa jcop & Smart Cards Boemo ba Bophelo ba Sehlahisoa：Sehlahisoa se setifikeiti–Mohlala o teng Setifikeiti：BCTC e netefalitsoe(PBOC 3.0, PBOC 2.0) Setifikeiti sa Nsiccs se lebelletsoeng ka Hlakubele, 15 Visa, Setifikeiti sa MasterCard se lebelletsoeng bakeng sa Loetse, 15
Litšobotsi Tse ka Sehloohong Liapole tsa ROM：DUal PBOC 3.0, DUal PBOC 2.0, Nsiccs 1.1, PSE tse peli 1.2 Liapole tsa EEPROM Memori ea mosebelisi e teng：40K~80Kbytes
Tloaelo e Tloaelehileng Phatlalatso ea JC：2.2.1 Khopolo ea GP：2.1.1
Contact Interface Tloaelo e Tloaelehileng：ISO 7816 T = 0：Ho joalo T=1：Ho joalo
Sehokelo se se nang mabitso Tloaelo e Tloaelehileng：ISO 14443-2, -3, -4 Mofuta oa A o nang le mohlala oa M1 1K T = cl：Ho joalo Baud Tate：106Kbi / s, 212Kbi / s, 424Kbit / s ka litsela tse peli Khafetsa ts'ebetso ea ts'ebetso：13.56MHz
Li-algorithms tsa cryptographs Ea / 3ds：Ho joalo Aes：Ho joalo: 16,24 le 32 hantle RSA：Ee ho fihlela 2048 hanyane SHA1：Ho joalo Sha256：Ho joalo
'Mele oa karete Chip From/Mofuta：Ikopanye le, U se na taba, Dual Interface Mefuta e fapaneng ea lipakete tsa liindasteri tsa module tse batloang Antenna：Boholo bo felletseng(sebaka se thibetsoeng sa ho khabisa) Tloaelo e Tloaelehileng：ISO 14443-1 a lumellana, etc. Boitsebiso：PVC ea boemo ba banka e koaheletsoeng bakeng sa ho romella motho ka mong Theknoloji：Hot lamination joalo-joalo mekhoa e tloaelehileng ea ho etsa likarete tsa theknoloji Mothapo oa Magnetic：ISO 7811-4, -5 a lumellana
Karete ea CPU ea mantlha ea NXP J3H081 chip dual interface ke tharollo ea ts'ireletso e phahameng ea NXP bakeng sa lihlahisoa tse sebetsang hantle tsa karete ea chip e bohlale.. E loketse limmaraka tse sebelisang likopo tse ngata joalo ka libanka le lichelete, mehala ea puisano, Lipalangoang tsa sechaba, phihlello ya taolo ya phihlello le phihlello ya netweke. J3H081 dual interface CPU card JAVA card JCOP J3 V2.4.2 version e tshehetsa mabitso le mabitso ho bala le ho ngola, e na le mofuta oa JCOP J3 V2.4.2 oa sistimi e sebetsang, mme e fana ka li-byte tse 80k tsa memori ea EEPROM. NXP ea mantlha J3H081 chip dual interface karete ea CPU ke mofuta o ntlafalitsoeng oa chip ea J3A081, e ka morao e lumellana le J2A080, JCOP21-72K (JCOP21-72K chip ha e sa sebetsa) karete ea chip, e ka qalisoa ho latela litlhoko tse khethehileng tsa bareki, le ho fetola boleng ba ATR, The chip's Qalisa boleng ba T=0 kapa T=1. Phetolelo ea JCOP: JCOP J3 V2.4.2. J3H081 e fetile CEAL 5+ Setifikeiti. Li-algorithms tsa encryption tse tšehetsoeng ke J3H081 ke tse latelang: Ea / 3ds, Aes (256 likotoana), RSA (2048 likotoana), ECC GF (leq) (576 likotoana), SHA (512 likotoana), MD5, Peo ea Korea, TRING, Mofuta oa 3 oa SSCD, KEN Gen. RSA CRT& EC GF(leq). Tšehetso ea boikhethelo bakeng sa Mifare PLUS EV1 le Mifare Desfire EV2.
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