Litekanyetso tsa protocol: ISO 14443 Mofuta oa A/B, ISO 15693, Iso / IEC 18000-6b / 6c
Chip frequency: LF 125KHz/HF 13.56MHz/UHF 860-960MHz
Mofuta oa Chip: Mifare 1K S50, Mifare 4K S70, Mifareultralight10, MifareultralightC, KE KHOUTA SLI/SLI-S/SLI-L/SLIX, MifareDesfire2K/4k/8K, MFlPLUS2K/4K, Ti2048, EM4200, EM4305, EM4450, EM4102, TK4100, T5577, CET5500, Hitagl, Hit2, Hitags, FM1208(CPU), JAVA J2A040 Chip Card e nang le SIM Cut, Impinj M5, joalo-joalo.
Bala hole: LF / HF 2.5 ~ 10cm
Uhf 1 ~ 10m(Ho latela melao ea RF e ka har'a naha, TLHOKOMELISO E HLOKAHALA, le maemo a tikoloho.)
Nako ea ho bala: 1~2ms
Mocheso oa ho sebetsa: -20+ ~ + 85 ℃
Mongobo o sebetsang: 0~95%
Mamello: >100,000 linako
Ho boloka lintlha: >10 lilemo
Boitsebiso: Pampiri ea bonono (Pampiri e koahetsoeng)
Litekanyo: ISO STEM 85.6 × 54 × 54 × 54, sebopeho
Lisebelisoa: Etlile Aluminium Inlay kapa 0.13mm ea koporo ea koporo
E kenelletse: ultrasonic auto plant line / Othomathiki welding
Karete ea pampiri ea RFID ke ea sa tsoa hlaha, Karete ea Marang-rang ea Tikoloho, Phetisetso ea butle-butle ea ho sebelisa chelete ea PVC, e sebelisoang ho thepa e tsamaeang le bareki e potlakileng le indasteri ea boithabiso, joalo ka lipapali, Molumo oa audio, litekete tse joalo. Litšenyehelo tsa pheletso, melemo ea tlhahiso e bonolo.
Likarete tsa pampiri li ka sebelisoa ke pampiri e kentsoeng, 250g, 300g, 350g, 400g, 450g le botenya bo bong. Ka litšenyehelo tse tlase, lekunutu, Ts'ireletso ea tikoloho le ho boloka matla. Karete e nang le pampiri e kentsoeng habeli, Khatiso ea Bahlahisi e Phahameng joalo ka 95%, mmele wa karete ke o motle, ka morao ho ts'ebetso ea varnish kapa e koahelang ho sireletsa setšoantšo sa khatiso.
Lisebelisoa tse tloaelehileng
Karete ea boitsebahatso, Litharollo tsa karete e le 'ngoe, karete ea khoebo/campus, karete ea bese, ditefello tsa tsela e kgolo, ho paka, Linschertation, tsamaiso ea sechaba, Liteishene tsa khase, Tšireletso, telecom, moriana, TELISO,etc.
Molemo oa tlholisano:
Basebetsi ba nang le boiphihlelo;
Boleng bo botle;
Theko e ntle;
Tlhahiso e potlakileng;
Bokhoni bo boholo le lihlahisoa tse fapaneng;
Amohela taelo e nyane;
Lihlahisoa tsa ODM le OEM ho latela tlhoko ea moreki.
Ho hatisa: Khatiso ea Offset, Patone enke Khatiso, Khatiso ea mebala-bala, Khatiso ea Silkscreen, Khatiso ea mocheso, Khatiso ea ink-jet, Khatiso ea dijithale.
Likarolo tsa ts'ireletso: Watermark, Ho tlosoa ha laser, Hologram / OVD, Enke ea UV, Enke ea Optical Variable, Sebaka se patiloeng sa barcode / Barcode, Mookoli o hlophiloeng, Micro-mongolo, Guilloche.
Ba bang: Ho qala data ea IC chip / Encryption, Lintlha tse Fetohang, Lenaneo la makenete le etselitsoeng motho, Phanele ea ho saena, Barcode, Nomoro ea letoto, Ho khabisa, Khoutu ea DOD, Khoutu ea khokahano ea NBS, Shoa-khaola.
Fung
Mookameli oa thekiso