E ka boela ea fana ka lits'ebeletso tse ikhethileng ho fihlela mehopolo le litlhoko tsa hau tse ikhethileng, E ka boela ea fana ka lits'ebeletso tse ikhethileng ho fihlela mehopolo le litlhoko tsa hau tse ikhethileng

Litsebi tsa "sa6850 mohlala oa" (EA-RFID) sebetsa sebakeng sa konkreite se boletsoeng, 

Ngola data ea tlhaiso-leseling ea konkreite ea konkreite, le ka module ea ho fumana chelete, ho sebetsa module oa data, Module oa phetiso ea phetiso, Bontša Module oa data, Eba le ho lekola maemo a ho bokella lintlha tsa konkreite 'me u felise bosholu ba data. Hajoale, RFID technology has gradually become an indispensable technology and management means for cement prefabricated component factories to improve the management level of cement quality system, reduce management costs and enhance core competitiveness.

Main entsprechen botekgeniki
Mofuta oa Chip: low frequency/high frequency/ultra high frequency
Maqhubu a sebetsang (modulation method): 125KHz/13.56MHz/840~960MHz
Tekanyetso ea protocol: ISO14443 TypeA/ISO 15693/EPC C1 GEN2, ISO 18000-6C
Anti-Static: prevent static breakdown, withstand voltage above 5000V
Lilemo tsa ho sebetsa: > 10 lilemo
Ho boloka lintlha: > 10 lilemo
Boholo ba ho bala: 20~ 500 limilimithara, depending on reader power, Boholo ba Antenna, orientation and environmental conditions, and packaged chips
Mechanism ea Anti-Collion: E loketse ho bala ka litapole tse fapaneng (Depending on the RF chip model)
Chip working mode: Bala / ngola
Linako tse tlang: > 100,000 linako
Sebetsa mocheso: -20℃ ~ + 95 ℃
Mocheso oa polokelo: -20℃ ~ + 90 ℃
Boholo: 50× 50mm, thickness 0.8~1mm, e ka etsoa ka mokhoa o ikhethileng
Package material: PET, PVC
Boima ba 'mele: 3 ligrama