Tekheniki ParametersCommunication protocol: Karete ea tšehetso ea ISO/IEC14443 TypeAS: MF S50/S70 le likarete tse ling tsa chip, tšehetsa karete ea CPU (e tshehetsa dikahare tsa lekala la ho bala)Phepelo ea motlakase: DC 12V (±5%)Ho sebetsa hona joale: 55mAOutput sebopeho: Wiegend 26 kapa Wiegand 34 (fetola sebopeho sa tlhahiso ka karete ea tsamaiso)Induction sebaka: 30~100mmCard nako ea ho bala: <200msTransmission sebaka: 100 metresMocheso o sebetsang: -10℃~+60℃Mongobo o sebetsang: <90% lintho tse se nang condensingShell: 'Mala oa ABSShell: moeli oa silevera, black panelDimensions: 86×86×23mmBoima: …

Maemo a sehlooho a sehlooho a sebetsang khafetsa: 125KHz/13.56MHz mofuta oa boikhethelo oa ho bala karete: 125Karete ea ID ea KHz kapa 13.56MHz karete ea IC ea Khokahano ea puisano: Motlakase oa WG26: 3W Polokelo ea mosebelisi: 16000 likotoana Mocheso oa tikoloho: -20℃~+60 ℃ Mofuta oa konopo: mochini (ho se amehe) Boholo: 108× 78×20mm Shell: Tsebiso ea polasetiki: JavaScript e ea hlokahala bakeng sa litaba tsena.