Litlhaloso tsa Karete tsa TekhenikiChip Mofuta: MIFARETM UltralightTM AESCommunication Protocol: IEC/ISO 14443AOperating Frequency: 13.56MHzStorage bokgoni: 144 bytesRead/Ngola Sebaka: Ho fihla ho 10cmErase/Ngola Lipotoloho: E kholo ho feta 100,000 Nako ea ho Bala/Ngola: 1-2msOperating Mocheso: -20℃~+55℃ Nako ea ho Boloka Lintlha: 5 yearsEncapsulation Material: PVC/Polycarbonate/ABS/PET/PETG/Paper, 0.13 Copper WireSize: 85.5× 54×0.80±0.4mmCoil: Ultrasonic Automatic WindingWelding Process: Tsebiso ea ho Welding Spot Automatic: JavaScript e ea hlokahala bakeng sa litaba tsena.
Boholo: 2.5× 2.5cm ea motlakase: 2.7~ 5v @ 30ma e sebetsa khafetsa: 125KHZ e ts'ehetso ea chip: Ata5557, T5567, T5577 kapa chip e tsamaisang (Foromo ea Default Micchester Code RF / 32) Sehokedi: Kope ea serial (Sebopeho sa TTL-232) Bala hole: <7cm, Ngola sebaka: <6cm (T5557, T5567, T5577 Chip R / w, Ho latela morero o hloka ho khetha mojule o nepahetseng.) Hlokomela: Javascript e hlokahala bakeng sa sena …