Main technical parametersCommunication protocol: ISO 14443 Навъи A/B, ISO 15693, EPC GEN2 Class 1/ ISO 18000-6CCan package low-frequency chips (125КГц): TK4100, EM4200, T5577, Хитог 2, Хитог С, etc.Can package high-frequency chips (13.56протоколи интерфейси барномаи стандартии Windows CE): FM11RF08, M1 S50/S70, ULT, I-CODE2, NTAG215, TI2048, SRI512, etc.Can be packaged UHF chips (860МГс ~ 960 МГс): UCODE GEN2, ALIEN H3, Импинҷ M4, etc.Material: Soft SiliconeWorking years: > 10 yearsMaximum reading range: …