Main technical parameters Communication protocol: ISO 15693/ISO 18000-6C (EPC C1 GEN2) Tuʻo lahi hono fakalelé: HF 13.56MHz/UHF 840~960MHz Integrated chip: TI2048, ICODE 2, Alien Higgs3, etc. (can be packaged on demand) Tokolahi ʻo e meʻakai ʻoku tauhi aí: 1k/2k (ʻe lava ke fakapatonu) Laukonga mo e tohi mamaʻo: 10cm~4m (customized according to project needs) Mafana ʻo e ngaue: -25℃~+85℃ Packaging material: PVC+3M+ epoxy resin Surface treatment: soft crystal glue Label adhesive: …