Tag medium: air medium / glass medium Chip manufacturer: NXP Chip: KOUTI ʻO E U HSL (SL3 ICS30) Lau ʻa e Mode: passive non-contact IC chips Chip capacity: 2k(2048kiʻi) Siakale ʻo e fakapolokalama: 100,000 taimi hono pukepuke ʻo e fakamatalá: 10 years Chip structure: 64 poloka, 4bytes/block Communication protocol: ISO 18000-6B Operating frequency: regular production by default with 915MHz (can customized of European standard 868MHz) Baud vave: hake ki he …