Main technical parameters Chip type: NTAG213/NTAG215/NTAG216, etc. Material: Glass fiber Epoxy resin Dielectric layer: FR-4 Flame retardant properties: V0 Size: 10×20×1mm, can be customized Storage temperature: -30°C~+80°C Working temperature: -30°C~+90°C Packing: Vacuum packaging Notice: JavaScript is required for this content.