Iyahambelana ne-TI 2048 Ikhadi leChip, Ukuhambelana ne-ISO/IEC 15693 Umgaqo

Ihambelana ngokupheleleyo ne-TI 2048 itshiphu eveliswe eTshayina, sisitshiphu sethegi esisebenza rhoqo esinomgama omde wokusebenza ohambelana ne ISO/IEC. 15693 iprotocol kunye ne-ISO/IEC 18000-3 Iprotocol, ngokusebenza okulungiselelwe ngakumbi kweRF kunye nokuqinisekisa imigama ekude yokusebenza; Ukugcinwa kwedatha ethembekileyo ngakumbi kunye nenkxaso yokusetyenziswa kwedatha ekhuselekileyo. Inokusetyenziswa ngokubanzi kumathala eencwadi, ukhuseleko lwemveliso, ulawulo lwempahla eyingozi, ulawulo lwamayeza kunye neminye imimandla. Le ileyibhile ehlakaniphile i-ICs esekwe kwimigangatho ye-ISO ye-ISO/IEC 15693 kunye ne-ISO / IEC 18000-3 eye yaphucula ukusebenza kweRF kunye nokuthembeka kwe-EEPROM.

Iimbonakalo
Ujongano lweRF
I-ISO / IEC 15693
Ugqithiso olungenanxibelelwano lwedatha kunye nonikezelo lwamandla (akukho bhetri ifunekayo)
Umgama osebenzayo: ukuya kuthi ga kwi-1.5m (kuxhomekeke kwiiparamitha ezahlukeneyo njengomzekelo. amandla entsimi kunye nejometri ye-eriyali)
Ukusebenza rhoqo: 13.56MHz
Ukudluliselwa kwedatha ngokukhawuleza: 26 Kbit / s
Ukuthembeka okuphezulu kwedatha: 16-kancinci CRC, ukwenza isakhelo
I-anticollision yokwenyani
Isichongi soSapho seSicelo (Afi)
Isalathiso sefomathi sefomathi (Dsfid)
Bhala 2 Ibhloko iyaxhaswa
EEPROM
2k amasuntswana enkumbulo iyonke, yahlulwe phakathi 64 iibhloko (4 I-Byte nganye)
Ukugcinwa kwedatha ye 50 iminyaka
Bhala unyamezelo 100000 Imijikelezo
Ukhuseleko
Isazisi esisodwa kwisixhobo ngasinye, I-UID ayitshintsheki.
Indlela yokutshixa yebhloko yememori yomsebenzisi ngamnye (ukhuseleko lokubhala)
Tshixa indlela ye-DSFID, Afi, I-eapho

Usetyenziso
Amathala eencwadi
Ukuthegiswa kwenqanaba lento kumakhonkco okubonelela ngamayeza
Ukhuseleko lomgunyathi kwimpahla yabathengi
Izicelo zamashishini

Ithuba elihle lokhuphiswano:
Abasebenzi abanamava;
Umgangatho obalaseleyo;
Ixabiso elifanelekileyo;
Ukuhanjiswa okukhawulezayo;
Umthamo omkhulu kunye noluhlu olubanzi lweemveliso;
Yamkela iodolo encinci;
Iimveliso ze-ODM kunye ne-OEM ngokweemfuno zabathengi.

Ukushicilela: Ushicilelo lwe-Offset, Silkscreen Printing, Ukuprintwa kwe-Thermal, Ukuprintwa kwe-ink-jet, Ukushicilelwa kwedijithali.
Iimpawu zokhuseleko: I-Watermark, Ukukhutshwa kweLaser, Ihologram/OVD, UV inki, Optical Variable inki, Ibhakhowudi efihliweyo/ibhakhowudi imaski, Umnyama weBanga, Umbhalo omncinci.
Abanye: Idatha ye-Chip / encryption, Umgca wemagnethi eyenzelwe wena, Iphaneli yotyikityo, Ibhakhowudi, Inombolo yesiriyeli, Ukuhombisa, Ikhowudi yeDOD, NBS ikhowudi convex, Die-cut.