Awọn aṣayan ti ara ẹni: IC ni ërún, radio frequency, iwọn ati ki o ni pato, sisanra, apẹrẹ, surface pre-printed LOGO, Àpẹẹrẹ, nọmba, kikọ data, ati awọn ilana iṣelọpọ pataki miiran.
Main imọ sile IC chips: EM4200, TK4100, M1S50/S70,FM11RF08,Alien H4,etc. Awọn ọna igbohunsafẹfẹ: LF 125KHz/HF 13.56MHz Kika ati kiko ijinna: 2.5~ 10cm Kika ati kikọ akoko: 1-2ms nu aye: > 100,000 igba ṣiṣẹ otutu: -20℃ ~ + 85 ℃ Itoju data: >10 ọdun awọn ohun elo ti: PVC or acrylic, epoxy resin glue Overall dimensions: φ25/30/32mm, 20× 25mm, 22×22mm, 30× 30mm, ati be be lo, which can be customized
RFID intelligent induction badge, which can package various RFID chips such as ID/IC, is beautiful and generous, and can be used for school badge, company attendance, identity management, campus consumption, ati be be lo. The outside is a beautiful transparent epoxy crystal glue, with pins on the back. The RFID chip is packaged inside, mainly for LF/HF radio frequency, but also for UHF (840~ 960MHz). Badges without IC chips can also be provided.
ODM and OEM products can meet customer requirements.
Aṣoju elo Company and enterprise, attendance and identity management of campus students, management of apartments and residential quarters, owo ebun, ati be be lo.