Main technical parameters Chip type: NTAG213 / NTAG215 / NTAG216, ወዘተ. ቁሳዊ: Glass fiber Epoxy resin Dielectric layer: FR-4 Flame retardant properties: V0 Size: 1020 × 1mm ×, can be customized Storage temperature: -30°C~+80°C Working temperature: -30°C~+90°C Packing: Vacuum packaging Notice: ለዚህ ይዘት ጃቫ ስክሪፕት ያስፈልጋል.