Main technical parameters Chip type: NTAG213 / NTAG215 / NTAG216, etj. material: Glass fiber Epoxy resin Dielectric layer: FR-4 Flame retardant properties: V0 Size: 10× 20 cm 1mm, can be customized Storage temperature: -30°C~+80°C Working temperature: -30°C~+90°C Packing: Vacuum packaging Notice: JavaScript kërkohet për këtë përmbajtje.