Üblicherweise verwendete Chip: am meisten 203, am meisten 213, am meisten 215, NTAG216, FM11RF08, Ultraleicht, Ultralight C, I-Code SLI-X, Desfire 4K / 8K,etc.. Frequenzbereich: 13.0MHz~14.5MHz Protocol standard: ISO / IEC14443-A, ISO15693 Memory: according to the chip Commonly used size: 4.5×4.5mm, 8× 14mm, Φ6mm, Φ8mm, Φ10mm, Φ15mm, Φ20mm, Φ25mm, Φ30mm, or customized Thickness: 0.15~0.25mm Thickness with glue: 1.0~1.3mm Material: FR-4 Surface material: PCB Working mode: R/W Read/write …
Technical parametersIC chip: Außerirdischer H4, Impinj Monza 4QT,etc.Frequency range: 860MHz~960MHz Protocol standard: EPC C1 GEN2/ISO 18000-6CWorking mode: R/W Read/write times: >100000 times Size: Φ8mm, or customized Thickness: 0.15~0.25mm Material: FR-4 Surface material: PCB Working temperature: -25℃ ~ + 95 ℃ Lagertemperatur: 0℃ ~ + 25 ℃ Hinweis: Für diese Inhalte ist JavaScript erforderlich.