Commonly used chip: Ithanso kukupatsirani ntchito zosinthidwa makonda kuti mukwaniritse malingaliro anu ndi zosowa zanu 203, Ithanso kukupatsirani ntchito zosinthidwa makonda kuti mukwaniritse malingaliro anu ndi zosowa zanu 213, Ithanso kukupatsirani ntchito zosinthidwa makonda kuti mukwaniritse malingaliro anu ndi zosowa zanu 215, NTAG216, FM11RF08, omangidwa chip zitsanzo, Ultralight C, I code SLI-X, Desfire 4K/8K,etc.. Frequency range: 13.0MHz~14.5MHz Protocol standard: ISO/IEC14443-A, ISO15693 Memory: according to the chip Commonly used size: 4.5×4.5mm, 8×14mm, Φ6mm, Φ8mm, Φ10mm, Φ15mm, Φ20mm, Φ25mm, Φ30mm, or customized Thickness: 0.15~0.25mm Thickness with glue: 1.0~1.3mm Material: FR-4 Surface material: PCB Working mode: R/W Read/write …

Technical parametersIC chip: Mlendo H4, Impinj Monza 4QT,etc.Frequency range: 860MHz~960MHz Protocol standard: EPC C1 GEN2/ISO 18000-6CWorking mode: R/W Read/write times: >100000 times Size: Φ8mm, or customized Thickness: 0.15~0.25mm Material: FR-4 Surface material: PCB Working temperature: -25℃~+95℃ Storage temperature: 0℃~+25℃ Notice: JavaScript ndiyofunika pa izi.