Main technical parametersCommunication protocol: ISO 14443 Toupou / B, ISO 15693, Klas EPC GEN2 1/ ISO 18000-6CCan package low-frequency chips (125Ke): TK4100, EM4200, T5577, Hitag 2, Hitag S, etc.Can package high-frequency chips (13.56megaèrts): FM11RF08, M1 S50 / S70, Ult, I-CODE2, NTAG215, TI2048, SRI512, etc.Can be packaged UHF chips (860Megaèrts ~ 960MHz): UCODE Gen2, ETRANJE H3, Impinj m4, etc.Material: Soft SiliconeWorking years: > 10 yearsMaximum reading range: …