materiae packaging: Molding Protocol standards: ISO ISO 14443, ISO ISO 15693 Frequency ratio: 13.56MHz RFID chip: S50 NXP Mifare 1K, TI, Ultralight, etc Product size: 4mm×4mm; 5mm×6mm Product thickness: 0.5mm Antenna material: copper etching antenna (BT material substrate) legere procul: 0~ 50mm (depending reader,RFID chip, protocol standard, environment) Surface logo printing: laser code ( duos dimensionis codice, logo) operationem temperatus: -25℃ ~ LXXX ℃ (-13CLXXVI ℉ ℉ ~ +) temperatus repono: …