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FM S70 NTI Daim Card, Compatible nrog MF1 IC S70 Nti

QEB THIAB KEV PHEEJ YIG:
Nti daim Card , ,

qauv: H28

FM S70 with triple security authentication, encryption embedded control and communication logic circuit, with a high security performance.

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Chip Features
Operating Frequency: 13.56MHZ
Phem npaum li cas: 106Kbit/s
Operating distance: not less than 10cm (antenna geometry)
Half-duplex communication
Compliance with ISO/IEC 14443-A
M1 standard encryption algorithm
A typical transaction time: <100ms
EEPROM:
4096×8bits of EEPROM memory cells
64 independent sectors with a security structure to support a variety of applications
Access to the storage unit flexibly defined by the user according to their own requirements
High security: triple security certification. Highly secure data communications. For hierarchical key systems within each sector to set up two separate sets of keys.
Arithmetic functions: addition and subtraction operations can be performed
High reliability:
Wipe life: > 100,000 Zaug
Cov ntaub ntawv qhia txog tus kheej: > 10 Xyoos

Cards parameters
Ua hauj lwm kub: -20℃~+65℃
Wipe life: > 100,000 Zaug
Storage: > 10 Xyoos
luaj li cas: ISO standard card L 85.6×W 54×T 0.84(±0.4)mm, or specify the size
Ntaub: PVC/ABS/PET/PETG/Paper, 0.13mm copper wire
Encapsulation process: automatic ultrasonic automatic planting line/touch welding

FM S70 chip is Shanghai Fudan Microelectronics a non-contact IC card chip, capacity of 4K×8bits, in line with ISO14443-A protocol, operating frequency 13.56MHz, working distance of not less than 10cm.FM11RF32 chip compatible with MF1 IC S70 chip cards.
FM S70 with triple security authentication, encryption embedded control and communication logic circuit, with a high security performance. Chips of 64 independent sectors, to meet more application, widely used in public transportation card, campus card and many other applications, large capacity projects.

 

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Cov Neeg Ua Hauj Lwm Hauv Tsev Kawm Ntawv;
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Peev xwm loj thiab ntau hom khoom;
Txais tau daim ntawv txiav txim me me;
ODM thiab OEM khoom raws li tus neeg thov.

Luam ntawv: Offset Printing, Patone ink Printing, Spot-color printing, Silkscreen Printing, Thermal printing, Ink-dav hlau luam ntawv, Printing.
Kev ruaj ntseg nta: dej, Laser ablation, Hologram/OVD, UV, Kho qhov tseeb Variable ink, Hidden barcode/Barcode mask, Qib Rainbow, Micro-phau ntawv, Guilloche, Hot stamping.
Lwm tus: IC nti cov ntaub ntawv initialization/Encryption, Ntaub ntawv, Tus kheej magnetic stripe programmed, Xee npe, Barcode, Serial Serial nab npawb, Embossing, DOD code, NBS convex chaws, Die-cut.

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