Packaging materials: Molding Protocol standards: ISO 14443, ISO 15693 Frequency ratio: 13.56MHz RFID chip: NXP Mifare 1K S50, OF, Ultralight, etc Product size: 4mm×4mm; 5mm×6mm Product thickness: 0.5mm Antenna material: copper etching antenna (BT material substrate) Verenga chinhambwe: 0~50mm (depending reader,RFID chip, protocol standard, environment) Surface logo printing: laser kodhi ( maviri-dimensional kodhi, LOGO) Kushanda tembiricha: -25℃~+80℃ (-13℉~+176℉) Kuchengetedza tembiricha: …