Packaging materials: Molding
Te mau ture no te pae o te ture: ISO 14443, ISO 15693 Frequency ratio: 13.56MDT
Mau ohipa no TE MAU VAHINE (IDE): NXP Mifare 1K S50, TUHAA AHURU, Te mori hi'o ino, te tahi atu â
Faito o te tauihaa: 4mm×4mm; 5mm×6mm Product thickness: 0.5mm
Materia tauihaa haapa'o i te tauihaa haapa: copper etching antenna (BT material substrate)
Tai'o i te atearaa: 0~50mm (depending reader,Mau ohipa no TE MAU VAHINE (IDE), protocol standard, environment) Surface logo printing: laser code ( numera e piti-hoho'a-rahi-raa, HOHO'A TAPA'o)
Te anuvera o te ohipa: -25°C~+80°C (-13℉~+176℉)
Te anuvera o te haaputuraa: 0℃~+25℃ (32℉~+77℉) Data validity: reading/writing 100000 te mau hora
Puohuraa: bulk, braided tape or sucking disc packaging, te tahi atu â
RFID Miniature molding tag is the SeabreezeRFID LTD recently launched a new Chip-level miniature high frequency electronic tags, using specially designed antenna andprocessing technology, the finished final size of the electronic tag is 4mm×4mm, using molding package. Built-in miniature antenna, can be used alone or used module SMT. Achieve resistance high temperature, resistant low temperature, resistance chemical corrosion, resistance cleaning, resistance pressure, resistance demolition,close range reading performance, cycle can be repeated use of special RFID electronic tags.
Main application Medical instrument equipment, instrument, measuring appliance, communications electronic equipment, the valuables and other RFID traceability tracking and data management.
Te tata'uraa:
Te mau rave ohipa aravihi;
Maitai maitai;
Moni maitai roa a'e;
Haponoraa haapaeraa maa;
Te faito rahi e te mau tau hamaniraa rau;
Farii i te ana'iraa na'ina'i;
Te mau hamaniraa ODM e OEM mai te au i te aniraa a te hoani.
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