Packaging materials: Molding Protocol standards: ISO 14443, ISO 15693 Frequency ratio: 13.56MHz RFID chip: NXP Mifare 1K S50, TUHAA AHURU, Te mori hi'o ino, etc Product size: 4mm×4mm; 5mm×6mm Product thickness: 0.5mm Antenna material: copper etching antenna (BT material substrate) Tai'o i te atearaa: 0~50mm (depending reader,Mau ohipa no TE MAU VAHINE (IDE), protocol standard, environment) Surface logo printing: laser code ( numera e piti-hoho'a-rahi-raa, HOHO'A TAPA'o) Te anuvera o te ohipa: -25°C~+80°C (-13℉~+176℉) Te anuvera o te haaputuraa: …