Umzekelo: F1790
Chip: Umphambukeli H3 + Mifare 1K S50(okanye FM11RF08)
Imemori: 96bit/512bit+1KByte
Umgangatho weProtocol: I-ISO / IEC 18000-6C, EPC Class1 Gen2, ISO 14443 uhlobo
Rhoqo: 860~ 960MHz kunye ne-13.56MHz
Imo yokusebenza: R / w
Induction umgama: UHF: Isitayile esizinzileyo sokuhamba nge-6-8m (i-UHF Reader, P = 5w, 12Dbi)
HF: 2~ 10cm
Ubushushu bokusebenza: -20~ + 70 ℃ (-4℉ - + I-158 ℉)
Unyamezelo: >100,000 amaxesha
Ukugcinwa kwedatha: 10 iminyaka
Ubungakanani bekhadi: 85.5× 54 × 0.8mm
Izinto eziphathekayo: I-PVC / PET / PETG / I-ABS / Iphepha,njl.
Lawa ngamakhadi e-UHF + HF aphindwe kabini eMifare 1K S50 kunye neAlien Higgs3 RFID inlay encapsulation kunye, Unokufunda iindidi ezimbini zamaza ngaxeshanye. Yamkela ipateni yomsebenzi wokutsiba rhoqo, babe nesakhono esinamandla se-antijamming, umsebenzisi unokwenza kwaye afunde kwaye abhale idatha eqhelekileyo, yenza inkqubo yesicelo esikhethekileyo isebenze ngokukhawuleza, umgama wokufunda ungaphezulu 8 iimitha. 1024umthamo wememori encinci, kwihlabathi liphela 64 Inombolo yesazisi, uyilo lwebhendi ye-ultra-wide work frequency, ayihambelani kuphela nemigaqo yoshishino efanelekileyo, kodwa ingaphuhliswa ngokuguquguqukayo kwaye isetyenziswe, kwaye unokufunda kunye nokubhala iithegi ezininzi ngaxeshanye (ixhomekeke ku 50 amaqhekeza/iziqendu okanye ngaphezulu) ngaphandle Ngenxa yothintelo kunye neempembelelo yenani leethegi kwindawo yomsebenzi, indawo yokugcina ye-928-bit ivumela abasebenzisi ukuba benze ukufunda okufihliweyo, bhala, cima kwaye ubhale kwakhona imisebenzi. Ikwavula indawo ezinikeleyo yeempawu ezinikezelwe kubasebenzisi abachongiweyo.
I-chip ye-Mifare 1K S50 inokutshintshwa yi-FM11RF08 (FM S50) chip. Itshiphu ye-FM11RF08 yenziwe eTshayina, iyahambelana ngokupheleleyo ne-Mifare 1K S50 chip, ukusebenza okufanayo kunye neempawu, ngeenzuzo zexabiso eliphantsi.
Usetyenziso
Ulawulo lwezithuthi
Indawo yokupaka
Ulawulo lokufikelela
Izinto
Indawo yokuhlala
Ivenkile enkulu yokutya
Ithala leencwadi
Ukulawula impahla
Ukuchonga
Ulawulo lwabasebenzi
Ithuba elihle lokhuphiswano:
Abasebenzi abanamava;
Umgangatho obalaseleyo;
Ixabiso elifanelekileyo;
Ukuhanjiswa okukhawulezayo;
Umthamo omkhulu kunye noluhlu olubanzi lweemveliso;
Yamkela iodolo encinci;
Iimveliso ze-ODM kunye ne-OEM ngokweemfuno zabathengi.
Ukushicilela: Ushicilelo lwe-Offset, Silkscreen Printing, Ukuprintwa kwe-Thermal, Ukuprintwa kwe-ink-jet, Ukushicilelwa kwedijithali.
Iimpawu zokhuseleko: I-Watermark, Ukukhutshwa kweLaser, Ihologram/OVD, UV inki, Optical Variable inki, Ibhakhowudi efihliweyo/ibhakhowudi imaski, Umnyama weBanga, Umbhalo omncinci.
Abanye: Idatha ye-Chip / encryption, Umgca wemagnethi eyenzelwe wena, Iphaneli yotyikityo, Ibhakhowudi, Inombolo yesiriyeli, Ukuhombisa, Ikhowudi yeDOD, NBS ikhowudi convex, Die-cut.
Fung
Umlawuli wentengiso