Multi-frequency Card, Ikhadi le-RFID Multi-protocol, I-Composite RF Chip Card

I-Chip ye-Smart Chip ene-Magnetic Stripe Card Inhlanganisela elula noma inhlanganisela ye-chip ye-RF kanye ne-Chip Chip, noma i-chip evemvane ephezulu, I-UHF Chip yenhlanganisela elula yokuphikisana yalaba bobabili, kanye nenhlanganisela elula yezinhlobo ezimbili zekhadi le-protocol rf. Kungenye yokuqukethwe okuphezulu kwezobuchwepheshe, Ikhadi elisebenzayo elisebenza ngokugcwele,Ikhadi elilodwa linenhloso ehlukahlukene. Isetshenziswa ikakhulukazi ebhange, isikole, Iminyango Kahulumeni,njll.

Uhlobo Olujwayelekile lweKhadi le-Dual-Frequency Card
1, Ikhadi le-Smart elinekhadi le-magnetic strip
I-Chip engaxhumana nayo nge-magnetic strip ikhadi le-compound: njenge-hico ebunjiwe5542 +
I-RF Chip ene-Magnetic Strip Card Compound: njenge-MF1 S50 + Loco
2, I-RACIO FETERENCY Chip Chip Composite nge-Chip Chip engaxhumana nayo
I-LF chip ene-IC Chip Chip yokungaxhumana naye: njenge-id + balala5542; T5577 + Sle4442
I-HF chip kanye ne-IC Chip Compact: njenge-MF1 S50 + Sele5542
I-UHF Chip ne-IC Chip Compact: njenge-Gen2 + I-SLE5542; I-Legic + Slew4428
3, LF, HF, Uhf wenhlanganisela ezintathu zokuphikisana nalaba bobabili: Ibizwa nangokuthi ikhadi le-pul-frequency.
Ikhadi le-LF ngenhlanganisela ye-HF:njenge-ID + MF1 S50; T5577 + MF1 S50
Inhlanganisela yekhadi le-LF ne-UHF: njenge-ID + Gen2
Ikhadi le-HF ne-UHF Compound: njenge-MF1 S50 + Gen2
4, Ikhadi le-LF, Ikhadi le-HF, Ikhadi le-UHF elithathu: Ibizwa nangokuthi ikhadi lemvamisa kathathu.
Ikhadi le-LF, I-HF Card ne-UHF Card Composite: njenge-ID + MF1 S50 + Gen2
5, I-Compound yekhadi le-HF, Izinhlobo ezimbili zezivumelwano:Umshini ngangokunokwenzeka ungafundwa ngasikhathi sinye ngama-chips amabili ekhadini eliyinhlanganisela, Ukuze ugweme ukuphazamiseka.
ISO 14443 Ikhadi eliyinhlanganisela liyikhadi eline-ISO 14443 B: Isibonelo i-MF1 S50 + Three 1064
ISO 14443 Ikhadi ne-iso 14443 C Composite: Isibonelo i-MF1 S50 + Sony Chip
ISO 14443 Ikhadi ne-iso 15693 landela: Isibonelo i-MF1 S50 + TI 2048
ISO 14443 Ikhadi ne-iso 14443 F composite: Isibonelo i-MF1 S50 + ELLIC MIM256
ISO 14443 B Ikhadi futhi 14443 C Composite: njenge-thr1064 + sony chip
ISO 14443 B Ikhadi ne-ISO 15693 -hlangene: njenge-Th1064 + TI 2048
ISO 15693 ne-ISO 14443 F Card composite: njenge-TI 2048 + ELLIC Mim256

Inzuzo Yokuncintisana:
Abasebenzi Abanolwazi;
Ikhwalithi enhle kakhulu;
Intengo engcono kakhulu;
Ukulethwa okusheshayo;
Umthamo omkhulu kanye nohlu olubanzi lwemikhiqizo;
Yamukela i-oda elincane;
Imikhiqizo ye-ODM ne-OEM ngokwesidingo samakhasimende.

Ukuphrinta: Ukuphrinta kwe-Offset, Ukuphrinta kwesikrini sikasilika, Ukuphrinta okushisayo, Ukuphrinta kwe-ink-jet, Ukuphrinta kwedijithali.
Izici zokuphepha: I-Watermark, Ukukhishwa kwe-Laser, Ihologram/OVD, Uyinki we-UV, I-Optical Variable inki, Imaski yebhakhodi/Ibhakhodi efihliwe, UThingo Lwebanga, Umbhalo omncane.
Abanye: Ukuqaliswa kwedatha ye-chip/Ukubethela, Umugqa kazibuthe owenziwe waba ngewakho, Iphaneli yesiginesha, Ibhakhodi, Inombolo yomkhiqizo, Embossing, Ikhodi ye-DOD, Ikhodi ye-convex ye-NBS, I-Die-cut.