bahan Packaging: Molding Protocol standards: ISO 14443, ISO 15693 aspek frekuensi: 13.56MHz RFID chip: NXP MIFARE 1K S50, TI, Ultralight, etc Product size: 4mm Tiket 4mm; 5mm×6mm Product thickness: 0.5mm Antenna material: antena etching tembaga (BT materi landasan) kadohan maca: 0~ 50mm (gumantung maca,chip RFID, standar protokol, lingkungan) Lumahing printing logo: kode laser ( kode loro-dimensi, LOGO) digunakake suhu: -25℃ ~ 80 ℃ (-13℉ ~ 176 ℉) suhu Storage: …