Lisebelisoa tsa ho paka: Molding Protocol standards: ISO 14443, ISO 15693 Frequency ratio: 13.56MHz RFID chip: NXP Mifare 1K S50, TSA, JAVA J2A040 Chip Card e nang le SIM Cut, etc Product size: 4mm×4mm; 5mm×6mm Product thickness: 0.5mm Antenna material: copper etching antenna (BT material substrate) Bala hole: 0~ 50 limilimithara (depending reader,RFID chip, protocol standard, environment) Surface logo printing: laser code ( two-dimensional code, LETŠOAO) Sebetsa mocheso: -25℃~+80℃ (-13℉~+176℉) Mocheso oa polokelo: …