Materiales embalaje: Molding Protocol standards: Iso 14443, Iso 15693 Frequency ratio: 13.56MHz RFID chip: NXP Mifare 1 ë S50, NU'I, Ultralight, etc Product size: 4mm×4mm; 5mm×6mm Product thickness: 0.5mm Antenna material: copper etching antenna (BT material substrate) Distancia pa da: 0~50 mm (depending reader,Chip RFID, protocol standard, environment) Surface logo printing: Código láser ( código bidimensional, LOGOTIPO) Tsoxpa 'be̲fi: -25°C~+80°C (-13°F~ + 176°F) Tsoxpa almacenamiento: …