RFID Dry Inlay encapsulated intelligent high-performance chip, Inlay contained within the anti-collision mechanism that can effectively prevent data interference, suitable for multi-tag identification applications.
Materyal nga: PVC/PET/anti-metal material/easy-shredding paper/stickers paper,Aluminum etched antenna
frequency: HF 13.56MHz, UHF 860-960MHz.
Standard: ISO 14443/ISO 15693, EPC GEN2 ISO 18000 6C/6B
Basaha ang Distance: HF 3-5cm UHF 3-10M, Equipment associated with the reader, commonly 6-7M
Wafer: NXP Mifare 1 S50, gaan kaayong mga, NTAG203, I CODE SLI, Ako CODE SLIX, FM11F08, Ti2048; Alien H3 / H4, UCODE EPC Gen2, Ucode HSL, Ucode Gen2, G2 XL, G2XM, MONZA Gen2, ST XRA G2,etc.. Wafer manufacturers: NXP, Langyaw, Impinj
pagpahid sa kinabuhi: >100,000 mga panahon
Pagtipig: >10 tuig
Operation temperatura: -20℃ ~ + 55 ℃ (-4℉ ~ + 131 ℉) Reference size: 85.6× 54mm, 82×23mm, Ф30mm, 30×26mm,10×160mm,etc. Mahimo nga ipasibo
gibag-on: 0.07mm, total thickness over chip 330microns
packing: rolls or die-cut into individual
RFID Dry Inlay encapsulated intelligent high-performance chip, Inlay contained within the anti-collision mechanism that can effectively prevent data interference, suitable for multi-tag identification applications. RFID Dry Inlay with industry-leading anti-jamming performance and superior read sensitivity, interference in the work of the tag RF-intensive environment, the data read and write performance remains stable and reliable. Mainly used in a single product tracking, Pagdumala sa Chain Sakit, item-level tracking, ug uban pang mga uma. RFID Dry Inlay high-volume applications can also be packaged into various forms of electronic tags, label converting large quantities to meet demand for low cost, high performance and other advantages.
competitive Bentaha:
eksperyensiyadong mga Staff;
Maayo Kaayo nga kalidad;
labing maayo nga presyo;
Puasa delivery;
Dako nga kapasidad ug usa ka halapad nga-laing mga mga produkto;
Dawata gamay nga order;
ODM ug OEM mga produkto sumala sa panginahanglan ni customer.