RFID Dry Inlay encapsulated intelligent high-performance chip, Inlay contained within the anti-collision mechanism that can effectively prevent data interference, suitable for multi-tag identification applications.
Meafaitino: PVC/PET/anti-metal material/easy-shredding paper/stickers paper,Aluminum etched antenna
e fa'aumatia fa'ailoga pe a saeia: HF 13.56MHz, UHF 860-960MHz.
Tulaga: ISO 14443/ISO 15693, EPC GEN2 ISO 18000 6C/6B Read Distance: HF 3-5cm UHF 3-10M, Equipment associated with the reader, commonly 6-7M Wafer: NXP Mifare 1 S50, E tu'uina atu e le tagata fa'atau le HF, NTAG203, I CODE SLI, I CODE SLIX, FM11F08, Ti2048; Alien H3/H4, UCODE EPC Gen2, Ucode HSL, Ucode Gen2, G2 XL, G2XM, MONZA Gen2, ST XRA G2,etc.. Wafer manufacturers: NXP, Alien, Impinj Wipe life: >100,000 taimi
Teuina: >10 tausaga Operation temperature: -20℃~+55℃ (-4℉~+131℉) Reference size: 85.6×54mm, 82×23mm, Ф30mm, 30×26mm,10×160mm,ma isi. Mafai ona patino e
mafiafia: 0.07mm, total thickness over chip 330microns
Teuina: rolls or die-cut into individual
RFID Dry Inlay encapsulated intelligent high-performance chip, Inlay contained within the anti-collision mechanism that can effectively prevent data interference, suitable for multi-tag identification applications. RFID Dry Inlay with industry-leading anti-jamming performance and superior read sensitivity, interference in the work of the tag RF-intensive environment, the data read and write performance remains stable and reliable. Mainly used in a single product tracking, supply chain management, item-level tracking, ma isi fanua. RFID Dry Inlay high-volume applications can also be packaged into various forms of electronic tags, label converting large quantities to meet demand for low cost, high performance and other advantages.
Lelei Tauvaga:
Aufaigaluega poto masani;
Lelei sili ona lelei;
Tau sili ona lelei;
Faaooina anapogi;
Malosiaga tele ma le lautele lautele o oloa;
Talia laʻititi faʻatonuga;
ODM ma OEM oloa e tusa ma manaoga o tagata faʻatau.
Taliga
Pule faʻatau