RFID Dry Inlay encapsulated intelligent high-performance chip, Inlay contained within the anti-collision mechanism that can effectively prevent data interference, suitable for multi-tag identification applications.
iYaya: PVC/PET/anti-metal material/easy-shredding paper/stickers paper,Aluminum etched antenna
Levu ni gauna: VF 13.56M Lailai, UHF 860-960M Vakadonui.
iVakatagedegede: ISO 14443/ISO 15693, EPC GEN2 ISO 18000 6C/6B Read Distance: HF 3-5cm UHF 3-10M, Equipment associated with the reader, commonly 6-7M Wafer: NXP Mifare 1 S50, Cina kaukauwa, NTAG203, I CODE SLI, I CODE SLIX, FM11F08, iKa 2048; Alien H3/H4, UCODE EPC Gen2, Ucode HSL, Ucode Gen2, G2 XL, G2XM, MONZA Gen2, ST XRA G2,etc.. Wafer manufacturers: NXP, Alien, Impinj Wipe life: >100,000 kena gauna
Maroroi ni iYaya: >10 yabaki Operation temperature: -20°C~55°C (-4°F~131°F) Reference size: 85.6×54mm, 82×23mm, Ф30mm, 30×26mm,10×160mm,kei na so tale. E rawa ni buli me buli
Vavaku: 0.07mm, total thickness over chip 330microns
Vakasotari: rolls or die-cut into individual
RFID Dry Inlay encapsulated intelligent high-performance chip, Inlay contained within the anti-collision mechanism that can effectively prevent data interference, suitable for multi-tag identification applications. RFID Dry Inlay with industry-leading anti-jamming performance and superior read sensitivity, interference in the work of the tag RF-intensive environment, the data read and write performance remains stable and reliable. Mainly used in a single product tracking, lewai ni lewe ni isema ni veika me vakayagataki, item-level tracking, and other fields. RFID Dry Inlay high-volume applications can also be packaged into various forms of electronic tags, label converting large quantities to meet demand for low cost, high performance and other advantages.
iSotuva Veisisivi:
Vakailesilesi Kila Ka;
Totoka na kena ituvaki;
Kena isau vinaka duadua;
Vakau totolo;
Levu kei na veimataqali ivoli;
Ciqoma na ituvatuva lailai;
Iyaya ni ODM kei OEM me vaka na ka e gadrevi vei ira na kasitama.