RFID Dry Inlay encapsulated intelligent high-performance chip, Inlay contained within the anti-collision mechanism that can effectively prevent data interference, suitable for multi-tag identification applications.
materiāls: PVC/PET/pretmetāla materiāls/viegli sasmalcināms papīrs/uzlīmju papīrs,Aluminum etched antenna
Biežums: HF 13,56 MHz, UHF 860-960MHz.
Standarta: ISO 14443/ISO 15693, EPC GEN2 ISO 18000 6C/6B
Lasīt attālumu: HF 3-5cm UHF 3-10M, Ar lasītāju saistītais aprīkojums, commonly 6-7M
Vafele: NXP Mifare 1 S50, saistītu mikroshēmu modeļi, NTAG203, I Code Sli, ES KODU SLIX, FM11F08, Ti2048; Svešzemju H3/H4, UCODE EPC Gen2, Ucode HSL, Ucode Gen2, G2 XL, G2XM, MONZA Gen2, ST XRA G2,etc.. Wafer manufacturers: NXP, Svešs, Impinj
Noslaucīt dzīvi: >100,000 reizes
Uzglabāšana: >10 gadiem
Darbības temperatūra: -20℃ ~+55 ℃ (-4℉ ~+131 ℉) Reference size: 85.6× 54mm, 82× 23mm, Ф30mm, 30× 26mm,10×160mm,utt. Var pielāgot
Biezums: 0.07mm, total thickness over chip 330microns
Iepakošana: rolls or die-cut into individual
RFID Dry Inlay encapsulated intelligent high-performance chip, Inlay contained within the anti-collision mechanism that can effectively prevent data interference, suitable for multi-tag identification applications. RFID Dry Inlay with industry-leading anti-jamming performance and superior read sensitivity, interference in the work of the tag RF-intensive environment, the data read and write performance remains stable and reliable. Mainly used in a single product tracking, piegādes ķēdes vadība, item-level tracking, and other fields. RFID Dry Inlay high-volume applications can also be packaged into various forms of electronic tags, label converting large quantities to meet demand for low cost, high performance and other advantages.
Konkurences priekšrocības:
Pieredzējis personāls;
Izcila kvalitāte;
Labākā cena;
Ātra piegāde;
Liela ietilpība un plašs produktu klāsts;
Pieņemiet nelielu pasūtījumu;
ODM un OEM produkti atbilstoši klienta pieprasījumam.
Fung
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