RFID Dry Inlay encapsulated intelligent high-performance chip, Inlay contained within the anti-collision mechanism that can effectively prevent data interference, suitable for multi-tag identification applications.
Zakuthupi: PVC / Pet / Anti-Zitsulo / Pepala Losavuta,Aluminum etched antenna
Pafupipafupi: HF 13.56MHz, UHF 860-960MHz.
Wofanana: Iso 14443 / iso 15693, EPC Gen2 ISO 18000 6C/6B
Werengani mtunda: HF 3-5cm UHF 3-10M, Zida zogwirizanitsidwa ndi owerenga, commonly 6-7M
Walirongo: NXP Mimpare 1 O, omangidwa chip zitsanzo, NTAG203, Ndili nambala, NDIKODI SLIX, FM11F08, Ti2048; Mlendo H3 / H4, Ucode ec Gen2, Ucode hsl, Ucode Gen2, G2 xl, G2XM, MONZA Gen2, ST XRA G2,etc.. Wafer manufacturers: NXP, Mlendo, Zosintha
Pukuta moyo: >100,000 nthawi
Kusunga: >10 zaka
Kutentha kwa ntchito: -20℃~+55 ℃ (-4℉~+131℉) Reference size: 85.6× 54mm, 82× 23, Ф30mm, 30× 26m,10×160mm,etc.. Zitha kusinthidwa
Makulidwe: 0.07mm, total thickness over chip 330microns
Kupakila: rolls or die-cut into individual
RFID Dry Inlay encapsulated intelligent high-performance chip, Inlay contained within the anti-collision mechanism that can effectively prevent data interference, suitable for multi-tag identification applications. RFID Dry Inlay with industry-leading anti-jamming performance and superior read sensitivity, interference in the work of the tag RF-intensive environment, the data read and write performance remains stable and reliable. Mainly used in a single product tracking, kayang'aniridwe kazogulula, item-level tracking, ndi magawo ena. RFID Dry Inlay high-volume applications can also be packaged into various forms of electronic tags, label converting large quantities to meet demand for low cost, high performance and other advantages.
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