RFID Dry Inlay encapsulated intelligent high-performance chip, Inlay contained within the anti-collision mechanism that can effectively prevent data interference, suitable for multi-tag identification applications.
Material: PVC / PET / Anti-Metal Material / einfach-shredding Pabeier / Pousteren Pabeier,Al etched Drot
Frequenz: HF 13.56MHz, UHF 860-960MHz.
Standard: ISO 14443 / ISO 15693, EPC GEN2 ISO 18000 6C / 6B
liesen Distanz: HF 3-5cm
UHF 3-10M, Equipement mat de Lieser assoziéiert, allgemeng 6-7M
Wafer: NXP Mifare 1 S50, Ultralight, NTAG203, Ech CODE SLI, Ech CODE SLIX, FM11F08, Ti2048; Friem H3 / H4, UCODE EPC Gen2, Ucode HSL, Ucode Gen2, G2 XL, G2XM, Monza Gen2, ST XRA G2, etc..
Wafer Producteure: NXP, friem, Impinj
wëschen Liewen: >100,000 Mol
Stockage: >10 Joer
Operatioun Temperatur: -20℃ ~ + 55 ℃ (-4℉ ~ + 131 ℉)
Referenz Gréisst: 85.6× 54mm, 82× 23mm, Ф30mm, 30× 26mm,10× 160mm,etc. Kann adaptéiert
deck: 0.07mm, Ganzen deck iwwer Chip 330microns
Uërtschaft: Pechpabeier oder stierwen-Géigewier an eenzelne
RFID Dry Inlay encapsulated intelligent high-performance chip, Inlay contained within the anti-collision mechanism that can effectively prevent data interference, suitable for multi-tag identification applications. RFID Dry Inlay with industry-leading anti-jamming performance and superior read sensitivity, interference in the work of the tag RF-intensive environment, the data read and write performance remains stable and reliable. Mainly used in a single product tracking, Fourniture Kette Gestioun, item-level tracking, an aner Felder. RFID Dry Inlay high-volume applications can also be packaged into various forms of electronic tags, label converting large quantities to meet demand for low cost, high performance and other advantages.
kompetitiv Advantage:
erlieft Staff;
excellent Qualitéit;
beschte Präis;
fast Liwwerung;
Grouss Muecht an eng grouss Gamme vu Produiten;
Akzeptéieren kleng fir;
ODM an Equipment Produiten no Client senger Demande.
Fung
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