RFID Dry Inlay encapsulated intelligent high-performance chip, Inlay contained within the anti-collision mechanism that can effectively prevent data interference, suitable for multi-tag identification applications.
Ngaahi Nāunaú: PVC/PET/anti-metal material/easy-shredding paper/stickers paper,Aluminum etched antenna
Tuʻo Laó: HF 13.56 MHz, UHF 860-960MHz.
Tuʻunga Moʻui: ISO 14443/ISO 15693, EPC GEN2 ISO 18000 6C/6B
Lau ʻa e mamaʻo: HF 3-5cm UHF 3-10M, Equipment associated with the reader, commonly 6-7M Wafer: NXP Mifare 1 S50, Ultralight, NTAG203, ʻOKU OU KOUTI SLI, I CODE SLIX, FM11F08, Ti2048; Alien H3/H4, UCODE EPC Gen2, Ucode HSL, Ucode Gen2, G2 XL, G2XM, MONZA Gen2, ST XRA G2,etc.. Wafer manufacturers: NXP, Alien, Impinj
Holoholoʻi e moʻuí: >100,000 ngaahi taimi
Tukuʻanga Meʻatokoní: >10 ngaahi taʻu
Mafana ʻo e ngaue: -20° C ~ + 55 ° c (-4℉~+131℉) Reference size: 85.6×54mm, 82×23mm, Ф30mm, 30×26mm,10×160mm,etc. ʻE lava pē ke fakafeʻungaʻi
Matolu: 0.07MM, total thickness over chip 330microns
Ko hono faʻo: rolls or die-cut into individual
RFID Dry Inlay encapsulated intelligent high-performance chip, Inlay contained within the anti-collision mechanism that can effectively prevent data interference, suitable for multi-tag identification applications. RFID Dry Inlay with industry-leading anti-jamming performance and superior read sensitivity, interference in the work of the tag RF-intensive environment, the data read and write performance remains stable and reliable. Mainly used in a single product tracking, supply chain management, item-level tracking, and other fields. RFID Dry Inlay high-volume applications can also be packaged into various forms of electronic tags, label converting large quantities to meet demand for low cost, high performance and other advantages.
Faingamalie ke feʻauʻauhi:
Kau ngaue taukei;
ʻUlungaanga lelei ʻaupito;
Mahuʻinga taha;
Tufa ʻaukai;
Ivi lahi mo ha ngaahi naunau kehekehe;
Tali ʻa e kiʻi fakahokohoko siʻ;
ODM mo Ofetuku ʻa e koloa ʻo fakatatau ki he fie maʻu ʻa e kasitoma.