RFID Dry Inlay encapsulated intelligent high-performance chip, Inlay contained within the anti-collision mechanism that can effectively prevent data interference, suitable for multi-tag identification applications.
materjal: PVC/PET/antimetalli materjal/lihtsalt purustatav paber/kleebiste paber,Alumiiniumist söövitatud antenn
sagedus: HF 13,56MHz, UHF 860–960MHz.
Standard: ISO 14443/ISO 15693, EPC GEN2 ISO 18000 6C/6B
Loe Kaugus: HF 3-5cm UHF 3-10M, Lugejaga seotud seadmed, commonly 6-7M Wafer: NXP Mifare 1 S50, Ultralight, NTAG203, KOODIN SLI, Ma CODE Slix, FM11F08, Ti2048; Tulnukas H3/H4, UCODE EPC Gen2, Ucode HSL, Ucode Gen2, G2 XL, G2XM, MONZA Gen2, ST XRA G2,etc.. Wafer manufacturers: NXP, välismaalane, Impinj
Pühi elu: >100,000 korda
ladustamine: >10 aastat
töötemperatuur: -20℃ ~ + 55 ℃ (-4℉ ~ + 131 ℉)
Võrdlussuurus: 85.6× 54mm, 82× 23mm, F30 mm, 30× 26 mm,10× 160 mm,jne. Saab kohandada
paksus: 0.07mm, total thickness over chip 330microns
pakkimine: rolls or die-cut into individual
RFID Dry Inlay encapsulated intelligent high-performance chip, Inlay contained within the anti-collision mechanism that can effectively prevent data interference, suitable for multi-tag identification applications. RFID Dry Inlay with industry-leading anti-jamming performance and superior read sensitivity, interference in the work of the tag RF-intensive environment, the data read and write performance remains stable and reliable. Mainly used in a single product tracking, tarneahela juhtimine, item-level tracking, ja muud väljad. RFID Dry Inlay high-volume applications can also be packaged into various forms of electronic tags, label converting large quantities to meet demand for low cost, high performance and other advantages.
Konkurentsieelis:
kogenud personal;
suurepärane kvaliteet;
Parim hind;
Kiire kohaletoomine;
Suure võimsusega ja laia valikut tooteid;
Nõus väike, et;
ODM ja OEM tooteid vastavalt kliendi nõudlus.
Fung
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