RFID Dry Inlay encapsulated intelligent high-performance chip, Inlay contained within the anti-collision mechanism that can effectively prevent data interference, suitable for multi-tag identification applications.
Materjal: PVC/PET/anti-metal material/easy-shredding paper/stickers paper,Aluminum etched antenna
Frekwenza: HF 13.56MHz, UHF 860-960MHz.
Standard: ISO 14443/ISO 15693, EPC GEN2 ISO 18000 6C/6B
Aqra Distanza: HF 3-5cm UHF 3-10M, Equipment associated with the reader, commonly 6-7M Wafer: NXP Mifare 1 S50, Ultralight, NTAG203, I CODE SLI, I KODIĊI SLIX, FM11F08, Ti2048; Aljen H3/H4, UCODE EPC Gen2, Ucode HSL, Ucode Gen2, G2 XL, G2XM, MONZA Gen2, ST XRA G2,etc.. Wafer manufacturers: NXP, Alien, Impinj Wipe life: >100,000 żminijiet
Ħażna: >10 snin Operation temperature: -20℃ ~ + 55 ℃ (-4℉~+131℉) Reference size: 85.6×54mm, 82×23mm, Ф30mm, 30×26mm,10×160mm,eċċ. Jistgħu jiġu personalizzati
Ħxuna: 0.07mm, total thickness over chip 330microns
materjal kontra l-interferenza: rolls or die-cut into individual
RFID Dry Inlay encapsulated intelligent high-performance chip, Inlay contained within the anti-collision mechanism that can effectively prevent data interference, suitable for multi-tag identification applications. RFID Dry Inlay with industry-leading anti-jamming performance and superior read sensitivity, interference in the work of the tag RF-intensive environment, the data read and write performance remains stable and reliable. Mainly used in a single product tracking, supply chain management, item-level tracking, and other fields. RFID Dry Inlay high-volume applications can also be packaged into various forms of electronic tags, label converting large quantities to meet demand for low cost, high performance and other advantages.
Vantaġġ Kompetittiv:
Persunal b'Esperjenza;
Kwalità eċċellenti;
L-aħjar prezz;
Kunsinna veloċi;
Kapaċità kbira u firxa wiesgħa ta 'prodotti;
Aċċetta ordni żgħira;
Prodotti ODM u OEM skond it-talba tal-klijent.
Fung
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