RFID Dry Inlay encapsulated intelligent high-performance chip, Inlay contained within the anti-collision mechanism that can effectively prevent data interference, suitable for multi-tag identification applications.
Materiala: PVC / PET / Metal anti-Materiala / Erraza birrintzeko papera / eranskailu papera,Aluminiozko etena
Maiztasuna: HF 13,56 MHz, UHF 860-960MHz.
Kalitate: ISO 14443 / ISO 15693, EPC Gen2 ISO 18000 6C/6B
Irakurri Distantzia: HF 3-5cm UHF 3-10M, Irakurlearekin lotutako ekipoak, commonly 6-7M Wafer: Nxp mimpare 1 K 2, Ultralight, NTAG203, I CODE SLI, SLIX KODEA DUT, FM11F08, Ti2048; Alien H3 / H4, UCODE EPC Gen2, Ucode hsl, Ucode gen2, G2 xl, G2XM, MONZA Gen2, ST XRA G2,etc.. Wafer manufacturers: NXP, Airb, Impinj
Garbitu bizitza: >100,000 aldiz
Biltegiratzea: >10 urteak
Eragiketa tenperatura: -20℃ ~ + 55 ℃ (-4℉ ~ + 131 ℉)
Erreferentzia tamaina: 85.6×54 mm, 82× 23mm, F30mm, 30× 26mm,10× 160mm,etab. Pertsonaliza daiteke
Lodiera: 0.07mm, total thickness over chip 330microns
Enbalatzea: rolls or die-cut into individual
RFID Dry Inlay encapsulated intelligent high-performance chip, Inlay contained within the anti-collision mechanism that can effectively prevent data interference, suitable for multi-tag identification applications. RFID Dry Inlay with industry-leading anti-jamming performance and superior read sensitivity, interference in the work of the tag RF-intensive environment, the data read and write performance remains stable and reliable. Mainly used in a single product tracking, Hornidura-katearen kudeaketa, item-level tracking, and other fields. RFID Dry Inlay high-volume applications can also be packaged into various forms of electronic tags, label converting large quantities to meet demand for low cost, high performance and other advantages.
Abantaila lehiakorra:
Esperientziadun Langileak;
Kalitate bikaina;
Preziorik onena;
Entrega azkarra;
Edukiera handia eta produktu sorta zabala;
Onartu eskaera txikia;
ODM eta OEM produktuak bezeroaren eskariaren arabera.
Onddoa
Salmenten kudeatzailea