RFID Dry Inlay encapsulated intelligent high-performance chip, Inlay contained within the anti-collision mechanism that can effectively prevent data interference, suitable for multi-tag identification applications.
સામગ્રી: PVC/PET/એન્ટી-મેટલ મટિરિયલ/ઇઝી-શ્રેડિંગ પેપર/સ્ટીકર્સ પેપર,Aluminum etched antenna
આવર્તન: HF 13.56MHz, UHF 860-960MHz.
ધોરણ: આઇએસઓ 14443/આઇએસઓ 15693, EPC GEN2 ISO 18000 6C/6B
અંતર વાંચો: HF 3-5cm UHF 3-10M, રીડર સાથે સંકળાયેલ સાધનો, commonly 6-7M
વેફર: NXP Mifare 1 S50, અલ્ટ્રાલાઇટ, NTAG203, I કોડ SLI, હું કોડ સ્લિક્સ, FM11F08, ટી2048; એલિયન એચ 3/એચ 4, UCODE EPC Gen2, યુકોડ HSL, યુકોડ જેન2, G2 XL, G2XM, MONZA Gen2, ST XRA G2,etc.. Wafer manufacturers: એનએક્સપી, પરાયું, ઇમ્પીંજ
જીવન સાફ કરવું: >100,000 વખત
સંગ્રહ: >10 વર્ષ
ઓપરેશન તાપમાન: -2055+55 ℃ (-4℉~+131℉) Reference size: 85.6×54 મીમી, 82Mm 23 મીમી, Ф30mm, 30Mm 26 મીમી,10×160mm,વગેરે. કસ્ટમાઇઝ કરી શકાય છે
જાડાઈ: 0.07મીમી, total thickness over chip 330microns
પેકિંગ: rolls or die-cut into individual
RFID Dry Inlay encapsulated intelligent high-performance chip, Inlay contained within the anti-collision mechanism that can effectively prevent data interference, suitable for multi-tag identification applications. RFID Dry Inlay with industry-leading anti-jamming performance and superior read sensitivity, interference in the work of the tag RF-intensive environment, the data read and write performance remains stable and reliable. Mainly used in a single product tracking, supply chain management, item-level tracking, અને અન્ય ક્ષેત્રો. RFID Dry Inlay high-volume applications can also be packaged into various forms of electronic tags, label converting large quantities to meet demand for low cost, high performance and other advantages.
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