RFID Dry Inlay encapsulated intelligent high-performance chip, Inlay contained within the anti-collision mechanism that can effectively prevent data interference, suitable for multi-tag identification applications.
Stuth: PVC/PET/anti-metal material/easy-shredding paper/stickers paper,Aluminum etched antenna
Tricead: HF 13.56MHz, UHF 860-960MHz.
Cairt èifeachd RFID O.VI.Print: ISO 14443/ISO 15693, EPC GEN2 ISO 18000 6C/6B
Leugh Astar: HF 3-5cm UHF 3-10M, Equipment associated with the reader, commonly 6-7M
Wafer: NXP Mifare 1 S50, Ultralight, NTAG203, I CODE SLI, I COGADH SLIX, FM11F08, Ti2048; Alien H3 / H4, UCODE EPC Gen2, Ucode HSL, Ucode Gen2, G2 XL, G2XM, MONZA Gen2, ST XRA G2,etc.. Wafer manufacturers: NXP, Alien, Impinj
Glan beatha: >100,000 amannan
Stòradh: >10 bliadhna
Teòthachd obrachaidh: -20℃ ~ + 55 ℃ (-4℉ ~ + 131 ℉) Reference size: 85.6×54mm, 82×23mm, Ф30mm, 30× 26mm,10×160mm,msaa. Faodar a ghnàthachadh
Tigheadas: 0.07mm, total thickness over chip 330microns
Pacadh: rolls or die-cut into individual
RFID Dry Inlay encapsulated intelligent high-performance chip, Inlay contained within the anti-collision mechanism that can effectively prevent data interference, suitable for multi-tag identification applications. RFID Dry Inlay with industry-leading anti-jamming performance and superior read sensitivity, interference in the work of the tag RF-intensive environment, the data read and write performance remains stable and reliable. Mainly used in a single product tracking, supply chain management, item-level tracking, and other fields. RFID Dry Inlay high-volume applications can also be packaged into various forms of electronic tags, label converting large quantities to meet demand for low cost, high performance and other advantages.
Buannachd Farpaiseach:
Luchd-obrach eòlach;
Càileachd sàr-mhath;
Prìs as fheàrr;
Lìbhrigeadh luath;
Comas mòr agus raon farsaing de thoraidhean;
Gabh ri òrdugh beag;
Bathar ODM agus OEM a rèir iarrtas luchd-ceannach.
Fung
Manaidsear-reic