RFID Dry Inlay encapsulated intelligent high-performance chip, Inlay contained within the anti-collision mechanism that can effectively prevent data interference, suitable for multi-tag identification applications.
awọn ohun elo ti: PVC/PET/anti-metal material/easy-shredding paper/stickers paper,Aluminiomu etched eriali
igbohunsafẹfẹ: HF 13.56MHz, UHF 860-960MHz.
Standard: ISO 14443/ISO 15693, EPC GEN2 ISO 18000 6C/6B
ka Distance: HF 3-5cm UHF 3-10M, Equipment associated with the reader, commonly 6-7M
wafer: NXP Mifare 1 S50, Ultralight, NTAG203, Mo CODE SLI, Mo CODE SLIX, FM11F08, Ti2048; Ajeeji H3 / H4, UCODE EPC Gen2, Ucode HSL, Ucode Gen2, G2 XL, G2XM, MONZA Gen2, ST XRA G2,etc.. Wafer manufacturers: NXP, ajeeji, Impinj
mu ese aye: >100,000 igba
Ibi: >10 ọdun
isẹ ti otutu: -20℃ ~ + 55 ℃ (-4℉ ~ + 131 ℉)
Reference iwọn: 85.6× 54mm, 82× 23mm, Ф30mm, 30× 26mm,10× 160mm,ati be be lo. Le ti wa ni adani
sisanra: 0.07mm, total thickness over chip 330microns
iṣakojọpọ: rolls or die-cut into individual
RFID Dry Inlay encapsulated intelligent high-performance chip, Inlay contained within the anti-collision mechanism that can effectively prevent data interference, suitable for multi-tag identification applications. RFID Dry Inlay with industry-leading anti-jamming performance and superior read sensitivity, interference in the work of the tag RF-intensive environment, the data read and write performance remains stable and reliable. Mainly used in a single product tracking, supply chain management, item-level tracking, ati awọn aaye miiran. RFID Dry Inlay high-volume applications can also be packaged into various forms of electronic tags, label converting large quantities to meet demand for low cost, high performance and other advantages.
ifigagbaga Advantage:
RÍ Oṣiṣẹ;
tayọ didara;
ti o dara ju owo;
o yara ifijiṣẹ;
Nla agbara ati ki o kan jakejado ibiti o ti ọja;
Gba kekere le;
ODM ati OEM awọn ọja gẹgẹ bi onibara ká eletan.
Fung
Alabojuto nkan tita