Qfn kunshin kwakwalwan kwamfuta, DFN ta ƙunshi kwakwalwan RFID, Qfn kunshin rfid kayayyaki, Dfn kunshin rfid kayayyaki, Qfn kunshin iC s, DFN ta shirya lakabi

In the specialized RFID tag manufacturing industry, high-temperature-resistant RFID chip packaging forms (such as QFN/DFN) are typically required. Through the SMT process, soldering of the RFID chip to the antenna can be achieved, simplifying production workflows and processes. Currently, semiconductor packaging involves large minimum order quantities, extended lead times, and even longer new product development cycles, severely constraining and impacting RFID tag manufacturers’ rapid delivery capabilities. RF-QFN/DFN packaging services enable rapid encapsulation of diverse RFID chip types.
QFN-packaged RFID modules and DFN-packaged RFID modules support chips across:

• Low-frequency bands: 125KHz / 134.2KHz
• High-frequency band: 13.56MHz
• Ultra-high-frequency bands: 860-960MHz
• Communication ladabi: ISO11784 / ISO11785, ISO14443A / B, ISO15693, ISO18000-6C/ISO18000-6B.
  8-inch wafers shipped in full trays. Contact us for small-batch sample customization.
  LF: Hitag, EM4200, EM4305, ATA5577, da dai sauransu.
  HF: Na CODE SLIX, FM11RF08, da dai sauransu.
  UHF: Monza MR6P, M730, M750; UCODE9, da dai sauransu.