QFN nakabalot ng RFID chips, DFN nakabalot ng RFID chips, QFN nakabalot ng mga module ng RFID, DFN nakabalot ng mga module ng RFID, QFN nakabalot na mga module ng IC, DFN Packaged IC Modules

In the specialized RFID tag manufacturing industry, high-temperature-resistant RFID chip packaging forms (such as QFN/DFN) are typically required. Through the SMT process, soldering of the RFID chip to the antenna can be achieved, simplifying production workflows and processes. Currently, semiconductor packaging involves large minimum order quantities, extended lead times, and even longer new product development cycles, severely constraining and impacting RFID tag manufacturers’ rapid delivery capabilities. RF-QFN/DFN packaging services enable rapid encapsulation of diverse RFID chip types.
QFN-packaged RFID modules and DFN-packaged RFID modules support chips across:

• Low-frequency bands: 125KHz / 134.2KHz
• High-frequency band: 13.56MHz
• Ultra-high-frequency bands: 860-960MHz
• protocol Communication: ISO11784 / ISO11785, ISO14443A / B, ISO15693, ISO18000-6C/ISO18000-6B.
  8-inch wafers shipped in full trays. Contact us for small-batch sample customization.
  LF: Hitag, EM4200, EM4305, ATA5577, etc.
  HF: I CODE SLIX, FM11RF08, etc.
  UHF: Monza MR6P, M730, M750; UCODE9, etc.