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In the specialized RFID tag manufacturing industry, high-temperature-resistant RFID chip packaging forms (such as QFN/DFN) are typically required. Through the SMT process, soldering of the RFID chip to the antenna can be achieved, simplifying production workflows and processes. Currently, semiconductor packaging involves large minimum order quantities, extended lead times, and even longer new product development cycles, severely constraining and impacting RFID tag manufacturers’ rapid delivery capabilities. RF-QFN/DFN packaging services enable rapid encapsulation of diverse RFID chip types.
QFN-packaged RFID modules and DFN-packaged RFID modules support chips across:

• Low-frequency bands: 125KHZ / 134.2Khz
• High-frequency band: 13.56MHz
• Ultra-high-frequency bands: 860-960MHz
• Mekhoa ea puisano: ISO11784/ISO11785, Isso14443a / b, TSOANG, ISO18000-6C/ISO18000-6B.
  8-inch wafers shipped in full trays. Contact us for small-batch sample customization.
  LF: Hitag, EM4200, EM4305, ATA5577, etc.
  HF: KE KOUTI SLIX, FM11RF08, etc.
  UHF: Monza MR6P, M730, M750; UCODE9, etc.