QFN спакувани чипови за РФИД, DFN спакувани чипови за РФИД, QFN спакувани модули на РФИД, DFN спакувани модули за РФИД, QFN спакувани модули за IC, DFN спакувани модули за IC

In the specialized RFID tag manufacturing industry, high-temperature-resistant RFID chip packaging forms (such as QFN/DFN) are typically required. Through the SMT process, soldering of the RFID chip to the antenna can be achieved, simplifying production workflows and processes. Currently, semiconductor packaging involves large minimum order quantities, extended lead times, and even longer new product development cycles, severely constraining and impacting RFID tag manufacturers’ rapid delivery capabilities. RF-QFN/DFN packaging services enable rapid encapsulation of diverse RFID chip types.
QFN-packaged RFID modules and DFN-packaged RFID modules support chips across:

• Low-frequency bands: 125KHz/134.2kHz
• High-frequency band: 13.56MHz
• Ultra-high-frequency bands: 860-960MHz
• Комуникациски протоколи: ISO11784/ISO11785, ISO14443A/B., ISO15693, ISO18000-6C/ISO18000-6B.
  8-inch wafers shipped in full trays. Contact us for small-batch sample customization.
  ЛФ: Хитаг, ЕМ4200, ЕМ4305, ATA5577, итн.
  HF: ЈАС КОДИРАМ СЛИКС, FM11RF08, итн.
  UHF: Monza MR6P, M730, M750; UCODE9, итн.